Journal cover

Electromagnetic Characteristics on Interposer Through Finite Element Analysis

Cheong-Ha Jung, Seong-Won Seo, Gu-Sung Kim
International Journal of Analytical, Experimental and Finite Element Analysis
Volume 10: Issue 2, June 2023, pp 29-34

Author's Information

Cheong-Ha Jung1 

Corresponding Author
1Electronic Package Research center, Kangnam University, Yongin-si, Korea
gkim@kangnam.ac.kr

Seong-Won Seo2

2Electronic Package Research center, Kangnam University, Yongin-si, Korea

Gu-Sung Kim3

3Electronic Package Research center, Kangnam University, Yongin-si, Korea

Article -- Peer Reviewed
Published online – 15 June 2023

Open Access article under Creative Commons License

Cite this article – Cheong-Ha Jung, Seong-Won Seo, Gu-Sung Kim, “Electromagnetic Characteristics on Interposer Through Finite Element Analysis”, International Journal of Analytical, Experimental and Finite Element Analysis, RAME Publishers, vol. 10, issue 2, pp. 29-34, June 2023.
https://doi.org/10.26706/ijaefea.2.10.20230102

Abstract:-
The 2.5D package is a package to which an interposer is applied to implement heterogeneous chips into one package. The core of 2.5D packaging technology is the interposer including TSV. Interposer technology with TSVs is getting a lot of attention in 2.5D packages, but 2.5D packages suffer from electromagnetic problems such as crosstalk, propagation delay, power noise, and thermal degradation. Therefore, in this study, scattering coefficient characteristics were simulated by controlling various factors of the interposer or TSV in the frequency range of 400 MHz to 20 GHz through an EM (Electromagnetic) solver, focusing on insertion loss and return loss. After modeling through AEDT (Ansys Electronics Desktop), simulations were performed for three factors: resistivity control of interposer, Cu filling factor control, and material change of Tsv center, and electrical characteristics for each simulation were analyzed.
Index Terms:-
Interposer, FEM, S-paramter, TSV.
REFERENCES
  1. International Technology Roadmap for Semiconductors (ITRS), Heterogeneous Integration Chapter, http://www.itrs2.net/
  2. John H. Lau, “Recent Advances and Trends in Fan-Out Wafer/Panel-Level Packaging”, J. Electron. Packag., Hongkong, vol. 141, May 2019.
  3. R. Mahajan et al., "Embedded Multidie Interconnect Bridge—A Localized, High-Density Multichip Packaging Interconnect," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 9, no. 10, pp. 1952-1962, Oct 2019.
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  5. Murayama, Kei, et al., “Warpage control of silicon interposer for 2.5D Package Application,” IEEE 63rd Electronic Components and Technology Conference, Las Vegas, NV, USA, pp. 879-884, May 2013.
  6. Shao, Shuai, et al., “Comprehensive study on 2.5D package design for board-level reliability in thermal cycling and power cycling,” 68th Electronic Components and Technology Conference(ECTC), San Diego, CA, USA, pp. 1668-1675, May 2018.
  7. Il-Woong Suh, et al., “Thermal Analysis of 3D package using TSV Interposer,” Journal of Microelectronics and Packaging, vol. 20, pp. 43-51, 2014.
  8. Choi Sumin, et al., “Crosstalk-Included eye diagram estimation of high-speed and wide I/O interposer channel for 2.5D/3D IC,” IEEE 23rd Conference on Ele ctrical Performance of Electronic Packaging and Systems, Portaland, OR, USA, pp. 215-218, October 2014.
  9. You, Jhih-Wei, et al., “Performance characterization of TSV in 3D IC via sensitivity analysis,” IEEE 19th Asian Test Symposium, Shanghai, China, pp. 389-394, December 2010.
  10. Kim, Joohee, Jonghyun Cho, and Jongho Kim. “TSV modeling and noise coupling in 3D IC,” IEEE 3rd Electronics System Integration Technology Conference ESTC, Berlin, Germany, pp. 1-6, September 2010.
  11. Junsung Ma, Sarah Eunkung Kim, and Sungdong Kim. “The effects of Cu TSV on the Thermal Conduction in 3D stacked IC,” Journal of the Microelectronics and Packaging Society, vol. 21, pp. 63-66, 2014.
  12. Lin, Yi-Hang, et al., “Multilayer RDL interposer for heterogeneous device and module integration,” IEEE 69th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, pp.931-936, May 2019.
  13. Lee, Hyunsuk, et al., “Electrical performance of high bandwidth memory(HBM) interposer channel in terabyte/s bandwidth graphics module,” IEEE International 3D Systems Integration Conference (3DIC), Sendai, Japan, pp. TS2. 2.1 -TS2. 2.4, August 2015.
  14. Jung, Cheong-Ha, Seong-won Seo, and Gu-sung Kim. “Parasitic efeect analysis in TSV design factors,” IEEE 24th Electronics Packaging Technology Conference (EPTC), Singapore, pp. 249-251, December 2022.
  15. Sunohara, Masahiro et al., “Studies on electrical performance and thermal stress of a silicon interposer with TSVs,” Proceedings 60th Electronic Components and Technology Conference (ECTC), pp. 1088-1093, June 2010.
  16. EN Abramova, et al., “Porous silicon for drug delivery systems,” Journal of Physics: Conference Series, April 2017.

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"/> Electromagnetic Characteristics on Interposer Through Finite Element Analysis
Journal cover

Electromagnetic Characteristics on Interposer Through Finite Element Analysis

Cheong-Ha Jung
International Journal of Analytical, Experimental and Finite Element Analysis
Volume 10: Issue 1, March 2023, pp 21-28

Author's Information

Cheong-Ha Jung1 

Corresponding Author
1Electronic Package Research center, Kangnam University, Yongin-si, Korea
gkim@kangnam.ac.kr
Article -- Peer Reviewed
Published online – 31 March 2023

Open Access article under Creative Commons License

Cite this article – Cheong-Ha Jung, “Electromagnetic Characteristics on Interposer Through Finite Element Analysis”, International Journal of Analytical, Experimental and Finite Element Analysis, RAME Publishers, vol. 10, issue 1, pp. 21-28, March 2023.
https://doi.org/10.26706/ijaefea.2.10.20230102

Abstract:-
The 2.5D package is a package to which an interposer is applied to implement heterogeneous chips into one package. The core of 2.5D packaging technology is the interposer including TSV. Interposer technology with TSVs is getting a lot of attention in 2.5D packages, but 2.5D packages suffer from electromagnetic problems such as crosstalk, propagation delay, power noise, and thermal degradation. Therefore, in this study, scattering coefficient characteristics were simulated by controlling various factors of the interposer or TSV in the frequency range of 400 MHz to 20 GHz through an EM (Electromagnetic) solver, focusing on insertion loss and return loss. After modeling through AEDT (Ansys Electronics Desktop), simulations were performed for three factors: resistivity control of interposer, Cu filling factor control, and material change of Tsv center, and electrical characteristics for each simulation were analyzed.
Index Terms:-
Interposer, FEM, S-paramter, TSV.
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  3. Bogoslovsky V.N. Thermophysics of heat recovery devices for heating, ventilation and air conditioning systems / V.N. Bogoslovsky, M. Ya. Pos.- M .: Stroyizdat, 1983. – 320 p.
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  8. Industrial heat and mass transfer processes and installations. / Ed. A.M. Baklastova / -M.: Energoatomizdat, 1986. – 328 p.
  9. Industrial heat and power engineering and heat engineering: Handbook / Under. ed. V. A. Grigorieva and V. M. Zorin / - M .: Energoatomizdat, 1991 .-- 588 p.
  10. D. V Bhise, S. A. Choudhari, M. A. Kumbhalkar, M. M. Sardeshmukh, “Modelling the Critical Success Factors for Advanced Manufacturing Technology Implementation in Small and Medium Sized Enterprises”, 3C Empresa, Ed. 50 Vol. 11 No. 2, August - December 2022, pp 263 - 275.
    Crossref
  11. Bhise, D. V., Choudhari, S. A., Kumbhalkar, M., & Sardeshmukh, M. M., “Assimilation of advanced manufacturing technologies in small and medium sized enterprises: an empirical analysis”, Multidisciplinary Science Journal, volume 5, issue 4, 2023.
    Crossref
  12. SP 41–101–95 Designing of heating points - M.: Ministry of Construction of Russia, 1976. - 78p.

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